NH-2000A Serie Reflow-Lötsystem mit Impulshitze (ehemals MHBR)
Das NH-2000 Serie Bügellötsystem mit Impulshitze (Pulsed Heat) von MIYACHI ist ein voll integriertes Hot-Bar-System, das eine gepulste Wärmethermotechnologie für Bügellöten und Heat Staking-Anwendungen verwendet, die eine Kraft zwischen 8 und 80 Newton erfordern.
Key Features NH-2000A Series Pulsed Heat Reflow Soldering System
- Compact and flexible systems for high quality connections
- Connecting displays to PCB, bonding glass panel displays and flex foils
- User friendly system configuration, including optional plug & play modules
- Pulsed Heat process control proven technology through UF4000A Power Supply
- Ideal price-performance (throughput) ratio
- CE approved
- Pneumatic bond head, X-Y Hot Bar planarity adjustment and electronic system control included
Specifications NH-2000A Serie Reflow-Lötsystem mit Impulshitze (ehemals MHBR)
Modell | |||
---|---|---|---|
Leistungsanforderungen | 100-240 VAC / Single Phase / 50/60 Hz (16 Amps max) | ||
Air supply | 6 – 8 bar [ 87 – 116 psi ] , clean dry & filtered air | ||
Abmessungen der Grundplatte der Montagevorrichtung | 150 x 150 mm | ||
Gewicht der Montagevorrichtung | 1,0 kg Max (per product fixture | ||
Thermode size (length x widht) [2-D / 3-D configuration | [2-D: up to 50,0 x 3,0 mm] [3-D: up to 75,0 x 4,0 mm] | ||
Inbetriebnahme | Two hand control | ||
Betriebstemperatur | 15 – 40 °C | ||
Betriebsfeuchtigkeit | Max 93% @ 40 °C | ||
Zertifizierung | CE Approved | ||
Bonding head & Uniflow-4 Technical specifications | |||
Kraftbereich | 8 – 80 N @ 6 Bar / 60 – 750 N @ 6 Bar ( applicable for both MHBR and MHSB models) | ||
Bondkopfhub (max.) | 45 mm | ||
Bondstufe | 40 mm | ||
Freier Z-Raum für Komponenten | 20 mm | ||
Temperaturbereich Leerlauf | 25 to 300 °C | Heat | 60 to 600 °C |
Temperaturbereich Grundwärme | 25 to 300 °C | Heat Extended Range | 60 to 999 °C |
Temperaturbereich Vorheizen | 60 to 500 °C | Postheat | 25 to 999 °C |
Zeitperiode (in Schritten von 0,1 s) Grundwärme | 0 to 99,9 seconds | Rise to Heat Time | 0 to 9,9 seconds |
Zeitperiode (in Schritten von 0,1 s) Anstieg zur Vorheizzeit | 0 to 9,9 seconds | Heat | 0,1 to 99,9 seconds |
Zeitperiode (in Schritten von 0,1 s) Vorheizen | 0 to 99,9 seconds or continuous | Postheat | 0 to 99,9 seconds |
Kommunikationsanschlüsse | RS-232, RS-485 | ||
MODEL SPECIFICATIONS | |||
NH-2100 Base | No movement | ||
NH-2200 Linear Slide (manual 2-position front-rear slide) | Stroke between front and bonding position: 200 mm fixe | ||
NH-2300 Rotary table (manual 2-position) | Turntable diameter: 380 mm | ||
NH-2400 Automatic Rotary table (pneumatic 2-position) | Turntable diameter: 380 mm Turntable movement time: < 2 seconds | ||
NH-3110 base | No movement | ||
NH-3210 linear slide (manual 2-position front-rear slide) | Stroke between front and bonding position: 200 mm fixed | ||
NH-3310 rotary table (manual 2-position) | Turntable diameter: 380 mm | ||
NH-3410 Automatic Rotary table (pneumatic 2-position) | Turntable diameter: 380 mm Turntable movement time: < 2 seconds | ||
GEWICHT UND ABMESSUNGEN | |||
Abmessungen H x B x T (mm) | 650 x 615 x 695 (excluding Power Supply) | ||
Gewicht | 60 kg (excluding Power Supply of approx. 30 kg) |
Drawings NH-2000A Serie Reflow-Lötsystem mit Impulshitze (ehemals MHBR)
Product applications NH-2000A Serie Reflow-Lötsystem mit Impulshitze (ehemals MHBR)
Flex soldering
Multiple flex bonding
Flex bonding
Wire soldering