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Hot Bar Reflow Soldering
Hot Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder coated parts are heated using a heating element (called a thermode or a Hot Bar) to a sufficient temperature to melt the solder.
The parts are then cooled below the solidification temperature to form a permanent electro-mechanical bond.
The Hot Bar Reflow Soldering process
Hot Bar Reflow Soldering is the ideal process for components that require very precise positioning. Pulsed-heated soldering differs from traditional soldering because the reflow of solder is accomplished using a heating element called a thermode (or Hot Bar), which is heated and cooled down for each connection. Pressure is applied during the entire cycle including heating, reflow, and cooling. Since pressure is applied during the complete cycle, the process is highly suited to parts that may disconnect during cooling down. Using the Hot Bar Reflow Soldering process allows multiple connections (up to > 100 mm length) to be made simultaneously in a single process cycle. Making these connections simultaneously also prevents wires from disconnecting while soldering the neighbouring wire.
Feasibility Testing
Contact us to certify your process by testing it in our laboratory. Our proven technologies enable the automotive, electronics & solar cell, IT & multimedia, medical, aerospace and defense industries to solder a variety of applications by using Hot Bar Reflow Soldering as a key technology.
Applications of Hot Bar Reflow Soldering
Typical examples of applications are connecting flex-foils to printed circuit boards, small wires, small coax cables and very light or small components.
The benefits of Hot Bar Reflow Soldering:
- Fast temperature ramp-up and cool-down
- Closed loop temperature control
- Accurate positioning of the parts
- Multiple connections can be made simultaneously
- Cost effective due to elimination of third component such as connector
