Heat Staking desktop systems
These Desktop Pulsed Heat series are part of a line of semi-automatic and automatic systems developed for Heat Staking and offer an ideal price-performance (throughput) ratio.
The Desktop Series Pulsed Heat Series is the first in a line of semi-automatic and automatic systems developed for Heat Staking. The “PH” stands for Pulsed Heat Hot bar. “CH” which stands for Constant Heat, is also available.
Key features Heat Staking desktop systems
- Small and flexible systems for high quality connections
- Ideal price-performance (throughput) ratio
- Simple adjustable frame construction
- For Heat-Seal bonding, Hot Bar Reflow Soldering and Heat Staking
- Reliable process control, by proven technology of Uniflow Power Supply
Specifications Heat Staking desktop systems
Power requirements | 100 to 240 VAC, 50/60 HZ, 16 Amp max | ||
---|---|---|---|
Air supply | 4 - 8 bar (60 - 120 psi), dry & filtered air | ||
Maximum fixture height | 50 mm (1.97 inch) | ||
Gantry open width | 520 mm (20.47 inch) | ||
Fixture assembly baseplate | 160 x 160 mm (6.30 x 6.30 inch) | ||
Starting operation | Two hand control | ||
Operating temperature | 15 - 40 °C | ||
Operating humidity | 93% @ 40 °C | ||
Bonding head & uniflow technical specifications | |||
Force range | SH 500: 50 - 500 N @ 6 Bar | SH 80: 8 - 80 N @ 6 Bar | |
Hot Bar stroke | SH 500: 50.0 mm | SH 80 : 50.0 mm | |
Temperature range Idle | 25 to 100 °C | Heat | 60 to 600 °C |
Temperature range Baseheat | 25 to 300 °C | Heat Extended Range | 60 to 999 °C |
Temperature range Preheat | 60 to 300 °C | Postheat | 0 to 99.9 seconds |
Time period (in 0.1 Sec increments) base heat | 0 to 99.9 seconds | Rise to Heat Time | 0 to 9.9 seconds |
Time period (in 0.1 Sec increments) rise to preheat time | 0 to 9.9 seconds | Heat | 0.1 to 99.9 seconds |
Time period (in 0.1 Sec increments) preheat | 0 to 99.9 seconds or continious | Postheat | 0 to 99.9 seconds |
Communication ports | RS-232, RS-485 |
Product applications Heat Staking desktop systems
Hot Bar reflow soldering
Heat-seal bonding
ACF bonding
Heat staking