Pulsed Heat Reflow Soldering is a selective soldering process where two pre-fluxed, solder-coated parts are heated with a thermode to a sufficient temperature to melt the solder. After this the parts are cooled below the solidification temerature to form a permanent electrodmechanical bond.
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Hot Bar Desktop Series
The MIYACHI Hot Bar Desktop Series is a range of tabletop models with a wide variety of product handling automations which offer high-quality process modules at the lowest investment. All of the Desktop Series systems can be used for: Hot Bar Reflow Soldering, ACF Bonding, Heat-Sealing and Heat Staking.
NH-3000A Series ACF Final Bonding system PH (formerly known as MHSB)
Depending on your specific application, MIYACHI's NH-3000 Series Heat Seal Bonding / Heat Staking Systems are available in two versions – a version using Constant Heat technology and another version using Pulsed Heat technology. The NH-3000 Series Heat-Seal Bonding systems are fully integrated, bonding systems which join parts utilizing our proven, constant heat or pulsed heat technologies, a pneumatic bonding head and a customized h
NH-3000A Series Heat‑Seal Bonding System CH (formerly known as MHSB)
Heat-Seal / ACF Final Bonding is the process of creating electrical conductive adhesive bonds between flexible and rigid circuit boards, glass panel displays and flex foils. This interconnection technique is mostly used for connecting displays to PCB's.
NH-4000A Series ACF Laminating System (formerly known as MACFL)
Designed for fine-pitch, ACF bonding applications (> 30 microns), the ACF (Anisotropic Conductive Film) Laminator uses a two or three-step process to connect materials such as flex-foil to glass or flex-foil to PCB.
Customized Solutions
Send your sample to one of our technology centers in Europe for an evaluation. We will then determine which solution meets your needs best. AMADA WELD TECH offers feasibility testing and application consulting.