Depending on your specific application, MIYACHI EAPRO’s newhorizon Heat Seal Bonding / Heat Staking Systems are available in two versions – a version using Constant Heat technology and another version using Pulsed Heat technology. The newhorizon Heat-Seal Bonding systems are fully integrated, bonding systems which join parts utilizing our proven, constant heat or pulsed heat technologies, a pneumatic bonding head and a customized hot
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newhorizon Hot Bar Desktop Series
The MIYACHI EAPRO newhorizon Hot Bar Desktop Series is a range of tabletop models with a wide variety of product handling automations which offer high-quality process modules at the lowest investment. All of the newhorizon Desktop Series systems can be used for: Hot Bar Reflow Soldering, ACF Bonding, Heat-Sealing and Heat Staking.
newhorizon ACF Laminating System
Designed for fine-pitch, ACF bonding applications (> 30 microns), the ACF (Anisotropic Conductive Film) Laminator uses a two or three-step process to connect materials such as flex-foil to glass or flex-foil to PCB.
newhorizon Heat-Seal Bonding System CH
Heat-Seal / ACF Final Bonding is the process of creating electrical conductive adhesive bonds between flexible and rigid circuit boards, glass panel displays and flex foils. This interconnection technique is mostly used for connecting displays to PCB's.
newhorizon Pulsed Heat Reflow Soldering System
Pulsed Heat Reflow Soldering is a slective soldering process where two pre-fluxed, solder-coated parts are heated with a thermode to a sufficient temperature to melt the solder. After this the parts are cooled below the solidification temerature to form a permanent electrodmechanical bond.
Customized Solutions
Send your sample to one of our technology centers in Europe for an evaluation. We will then determine which solution meets your needs best. AMADA WELD TECH offers feasibility testing and application consulting.