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newhorizon Heat-Seal Bonding System CH

Heat-Seal / ACF Final Bonding is the process of creating electrical conductive adhesive bonds between flexible and rigid circuit boards, glass panel displays and flex foils. This interconnection technique is mostly used for connecting displays to PCB's.

The Heat-Seal / ACF Final Bonding systems are an integral part of The Hot Bar Series using Constant Heat technology through the integrated system temperature controller, a pneumatic Bond Head and customized thermodes.

The newhorizon product range includes various models with different proudct handling features such as linear slides and rotary tables. The systems are designed considering ergonomic standards offering maximized production output. All process parameters are embedded into the system ensuring consistent process quality and operator independence.

The newhorizon systems are enable full automatic process control with manual (un-)loading of parts. Each system can be adapted to suit the customers technical requirements through extension with optional plug & play modules. All modules are mounted on a robust frame contruction. The system offers the best stability supporting applications down to the finest pitch.


Key Features newhorizon Heat-Seal Bonding System CH

  • Compact and flexible systems for high quality connections
  • Connecting displays to PCB, bonding glass panel displays and flex foils
  • User friendly system configuration, including optional plug & play modules
  • Integrated Constant Heat process control based on proven technology
  • Ideal price-performance (throughput) ratio
  • CE approved
  • Pneumatic bond head, X-Y Hot Bar planarity adjustment and electronic system control included
Power requirements 100-240 VAC / Single Phase / 50/60 Hz (16 Amps max)
Air supply 6 - 8 bar (87 - 116 psi), clean dry & filtered air
Fixture assembly baseplate dimensions 150 x 150 mm
Fixture weight 1.0 kg Max (per product fixture)
Constant heat thermode size (length x width) Min 3 x 1 mm / Max 75 x 5 mm
Starting operation Two hand control
Start-up time < 5 minutes
Operating temperature 15 - 40 °C
Operating humidity Max 93% @ 40 °C
Certification CE Approved
Bonding head & Temperature controller technical specifications
Force range 60 - 750 N @ 6 Bar
Bond head stroke (max) 45 mm
Bond level height 40 mm
Free Z space for components 20 mm
Temperature range 50 - 300 °C Constant heat
Temperature control accuracy +/- 2% of Full Scale
Bond time period 0,5 to 99,9 seconds
MHSB-3100 base No movement
MHSB-3200 linear slide (manual 2-position front-rear slide) Stroke between front and bonding position: 200 mm fixed
MHSB-3300 rotary table (manual 2-position) Turntable diameter: 380 mm
MHSB 3400 automatic rotary table (pneumatic 2-position) Turntable diameter: 380 mm. Turntable movement time:
Dimensions HxWxD (mm) 650 x 615 x 695
Weight 60 kg
CCD Camera
Multiple Flex
Flex - PCB
LCD Display

Customized Solutions

Send your sample to one of our technology centers in Europe for an evaluation. We will then determine which solution meets your needs best. AMADA WELD TECH offers feasibility testing and application consulting.