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newhorizon Pulsed Heat Reflow Soldering System

Pulsed Heat Reflow Soldering is a slective soldering process where two pre-fluxed, solder-coated parts are heated with a thermode to a sufficient temperature to melt the solder. After this the parts are cooled below the solidification temerature to form a permanent electrodmechanical bond. The newhorizon Hot Bar systems are an integral part of the HotBar series using Pulsed Heat technology throught the Uniflow-4 power supply, a pneumatic bond head and customized 2-D & 3-D thermodes.

The newhorizon product range includes various models with different product handling features such as linear slides and rotary tables. The systems are designed considering ergonomic standards offering maximized production output. All process parameters are embedded into the system, ensuring consistent process quality and operator independence. 

The newhorizon systems enable full automatic process control with manual (un-)loading of parts. Each system can be adapted to suit the customer's technical requirements through extension with optional plug & play modules. All modules are mounted on a robust frame construction. The system offers the best stability supporting applications down to the finest pitch.

 

Key Features newhorizon Pulsed Heat Reflow Soldering System

  • Compact and flexible systems for high quality connections
  • Connecting displays to PCB, bonding glass panel displays and flex foils
  • User friendly system configuration, including optional plug & play modules
  • Pulsed Heat process control proven technology through Uniflow-4 Power Supply
  • Ideal price-performance (throughput) ratio
  • CE approved
  • Pneumatic bond head, X-Y Hot Bar planarity adjustment and electronic system control included
Model
Power requirements 100-240 VAC / Single Phase / 50/60 Hz (16 Amps max)
Air supply 6 – 8 bar [ 87 – 116 psi ] , clean dry & filtered air
Fixture assembly baseplate dimensions 150 x 150 mm
Fixture weight 1,0 kg Max (per product fixture
Thermode size (length x widht) [2-D / 3-D configuration [2-D: up to 50,0 x 3,0 mm] [3-D: up to 75,0 x 4,0 mm]
Starting operation Two hand control
Operating temperature 15 – 40 °C
Operating humidity Max 93% @ 40 °C
Certification CE Approved
Bonding head & Uniflow-4 Technical specifications
Force range 8 – 80 N @ 6 Bar / 60 – 750 N @ 6 Bar ( applicable for both MHBR and MHSB models)
Bond head stroke (max) 45 mm
Bond level height 40 mm
Free Z space for components 20 mm
Temperature range Idle 25 to 300 °CHeat60 to 600 °C
Temperature range Baseheat 25 to 300 °C Heat Extended Range 60 to 999 °C
Temperature range Preheat 60 to 500 °CPostheat25 to 999 °C
Time period (in 0,1 sec increments) Base Heat 0 to 99,9 seconds Rise to Heat Time 0 to 9,9 seconds
Time period (in 0,1 sec increments) Rise to preheat time 0 to 9,9 seconds Heat0,1 to 99,9 seconds
Time period (in 0,1 sec increments) Preheat 0 to 99,9 seconds or continuousPostheat0 to 99,9 seconds
Communications ports RS-232, RS-485
MODEL SPECIFICATIONS
MHBR-2100 Base No movement
MHBR-2200 Linear Slide (manual 2-position front-rear slide) Stroke between front and bonding position: 200 mm fixe
MHBR-2300 Rotary table (manual 2-position) Turntable diameter: 380 mm
MHBR-2400 Automatic Rotary table (pneumatic 2-position) Turntable diameter: 380 mm Turntable movement time: < 2 seconds
MHSB-3110 base No movement
MHSB-3210 linear slide (manual 2-position front-rear slide) Stroke between front and bonding position: 200 mm fixed
MHSB-3310 rotary table (manual 2-position) Turntable diameter: 380 mm
MHSB-3410 Automatic Rotary table (pneumatic 2-position) Turntable diameter: 380 mm Turntable movement time: < 2 seconds
WEIGHT & DIMENSIONS
Dimensions HxWxD (mm) 650 x 615 x 695 (excluding Power Supply)
Weight 60 kg (excluding Power Supply of approx. 30 kg)
Flex soldering
Multiple flex bonding
Flex bonding
Wire soldering

Customized Solutions

Send your sample to one of our technology centers in Europe for an evaluation. We will then determine which solution meets your needs best. AMADA WELD TECH offers feasibility testing and application consulting.

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