Premium Process Monitoring for Reliable Hot Bar Reflow Soldering and Bonding requires being able to control all parameters. AMADA WELD TECH offers different monitoring and testing devices as well as calibration tools to optimize your Hot Bar Bonding process.
The new MG-300A Premium Hot Bar Monitoring system combines MIYACHI Hot Bar know-how with MIYACHI technical expertise in one unit. The MG-300A Hot Bar measures force, temperature, time and displacement and allow continuous control throughout the entire process cycle. The compact and flexible system features high quality Hot Bar connections and high throughput, all within an easily adjustable frame construction.
In order to achieve and maintain a consistent product envrionment, constant process parameters are required. For Hot Bar Reflow Soldering, Heat-Seal Bonding, Heat Staking, ACF Laminating and ACF Final Bonding, the most important process parameters are bond pressure, thermode planarity and process temperature.
Send your sample to one of our technology centers in Europe for an evaluation. We will then determine which solution meets your needs best. AMADA WELD TECH offers feasibility testing and application consulting.
