Unitips are electrodes for parallel gap bonding of gold plated kovar, copper, or gold ribbons (wires) which are smaller than 0.010 inches (0.25 mm). They are made from two pieces of molybdenum or tungsten, which are permanently bonded to an insulating spacer. This fixed gap and bonded construction results in a tip that wears uniformly when properly dressed. The length of the Unitip and the flat area on the front allows it to bond ribbons extremely closely to the walls of packages as deep as 0.450 inches (11.5 mm). The narrower Thinline “L” series Unitips have a tapered profile, enabling them to be used closer to the corners of packages.
Send your sample to one of our technology centers in Europe for an evaluation. We will then determine which solution meets your needs best. AMADA WELD TECH offers feasibility testing and application consulting.