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Reflow Soldering Desktop Systems

The Desktop Series deliver the same high bonding quality as the larger and more automated systems. It offers an ideal price-performance (throughput) ratio. The slide enables easy loading and unloading of the parts directly in front of the operator. If the parts require alignment, this can be done in the front (loading) position where the operator has sufficient free space for loading and alignment of the parts. The position of the camera offers a view that is not blocked by the bonding head. The automatic slide makes improves control when positioning parts positioning compared to manually operated slides. It also enables the operator to spend time on other actions. such as preparing the next parts in between bonding cycles.

Key Features Reflow Soldering Desktop Systems

  • Small and flexible systems for high quality connections
  • Ideal price-performance (throughput) ratio
  • Simple adjustable frame construction
  • For Heat-Seal bonding, Hot Bar Reflow Solderign and Heat Staking
  • Reliable process control, by proven technology of Uniflow Power Supply
Power requirements 100 to 240 Vac, 50/60 HZ, 16 Amp max
Air supply 4-8 bar (60-120 psi), dry & filtered air
Maximum fixture height 50 mm (1.97 inch)
Gantry open width 520 mm (20.47 inch)
Fixture assembly baseplate 160 x 160 mm (6.30 x 6.30 inch)
Starting operation Two hand control
Operating temperature 15 - 40 °C
Operating humidity 93% @ 40 °C
Bonding head & uniflow technical specifications
Force range SH 500:50 - 500 N @ 6 Bar - SH 80:8 - 80 N @ 6 bar
Hot Bar stroke SH 500: 50.0 mm - SH 80 : 50.0 mm
Temperature range Idle 25 to 100 °CHeat60 to 600 °C
Temperature range Baseheat 25 to 300 °CHeat Extended Range60 to 999 °C
Temperature range Preheat 60 to 300 °CPostheat25 to 600 °C
Time period (in 0,1 sec increments) Base Heat 0 to 99.9 secondsRise to Heat Time0 to 9.9 seconds
Time period (in 0,1 sec increments) Rise to preheat time 0 to 9.9 secondsHeat0.1 to 99.9 seconds
Time period (in 0.1 Sec increments) preheat 0 to 99.9 seconds or continuousPostheat0 to 99.9 seconds
Communications ports RS-232, RS-485
WEIGHT & DIMENSIONS 510 x 550 x 600
Weight (in kg) 40 kg (excluding Uniflow Power Supply)
Hot Bar reflow soldering
Heat-seal bonding
ACF bonding
Heat staking

Customized Solutions

Send your sample to one of our technology centers in Europe for an evaluation. We will then determine which solution meets your needs best. AMADA WELD TECH offers feasibility testing and application consulting.