Hot Bar reflow soldering
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Reflow Soldering Desktop Systems
The Desktop Series deliver the same high bonding quality as the larger and more automated systems. It offers an ideal price-performance (throughput) ratio. The slide enables easy loading and unloading of the parts directly in front of the operator. If the parts require alignment, this can be done in the front (loading) position where the operator has sufficient free space for loading and alignment of the parts. The position of the camera offers a view that is not blocked by the bonding head. The automatic slide makes improves control when positioning parts positioning compared to manually operated slides. It also enables the operator to spend time on other actions. such as preparing the next parts in between bonding cycles.
Key Features Reflow Soldering Desktop Systems
- Small and flexible systems for high quality connections
- Ideal price-performance (throughput) ratio
- Simple adjustable frame construction
- For Heat-Seal bonding, Hot Bar Reflow Solderign and Heat Staking
- Reliable process control, by proven technology of Uniflow Power Supply
| Model | |||
|---|---|---|---|
| Power requirements | 100 to 240 Vac, 50/60 HZ, 16 Amp max | ||
| Air supply | 4-8 bar (60-120 psi), dry & filtered air | ||
| Maximum fixture height | 50 mm (1.97 inch) | ||
| Gantry open width | 520 mm (20.47 inch) | ||
| Fixture assembly baseplate | 160 x 160 mm (6.30 x 6.30 inch) | ||
| Starting operation | Two hand control | ||
| Operating temperature | 15 - 40 °C | ||
| Operating humidity | 93% @ 40 °C | ||
| Bonding head & uniflow technical specifications | |||
| Force range | SH 500:50 - 500 N @ 6 Bar - SH 80:8 - 80 N @ 6 bar | ||
| Hot Bar stroke | SH 500: 50.0 mm - SH 80 : 50.0 mm | ||
| Temperature range Idle | 25 to 100 °C | Heat | 60 to 600 °C |
| Temperature range Baseheat | 25 to 300 °C | Heat Extended Range | 60 to 999 °C |
| Temperature range Preheat | 60 to 300 °C | Postheat | 25 to 600 °C |
| Time period (in 0,1 sec increments) Base Heat | 0 to 99.9 seconds | Rise to Heat Time | 0 to 9.9 seconds |
| Time period (in 0,1 sec increments) Rise to preheat time | 0 to 9.9 seconds | Heat | 0.1 to 99.9 seconds |
| Time period (in 0.1 Sec increments) preheat | 0 to 99.9 seconds or continuous | Postheat | 0 to 99.9 seconds |
| Communications ports | RS-232, RS-485 | ||
| WEIGHT & DIMENSIONS | 510 x 550 x 600 | ||
| Weight (in kg) | 40 kg (excluding Uniflow Power Supply) |
Heat-seal bonding
ACF bonding
Heat staking
Customized Solutions
Send your sample to one of our technology centers in Europe for an evaluation. We will then determine which solution meets your needs best. AMADA WELD TECH offers feasibility testing and application consulting.