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NH-3000A Series Heat‑Seal Bonding System CH (formerly known as MHSB)
Heat-Seal / ACF Final Bonding is the process of creating electrical conductive adhesive bonds between flexible and rigid circuit boards, glass panel displays and flex foils. This interconnection technique is mostly used for connecting displays to PCB's.
The Heat-Seal / ACF Final Bonding systems are an integral part of The Hot Bar Series using Constant Heat technology through the integrated system temperature controller, a pneumatic Bond Head and customized thermodes.
The product range includes various models with different proudct handling features such as linear slides and rotary tables. The systems are designed considering ergonomic standards offering maximized production output. All process parameters are embedded into the system ensuring consistent process quality and operator independence.
The systems are enable full automatic process control with manual (un-)loading of parts. Each system can be adapted to suit the customers technical requirements through extension with optional plug & play modules. All modules are mounted on a robust frame contruction. The system offers the best stability supporting applications down to the finest pitch.
Key Features NH-3000A Series Heat‑Seal Bonding System CH
- Compact and flexible systems for high quality connections
- Connecting displays to PCB, bonding glass panel displays and flex foils
- User friendly system configuration, including optional plug & play modules
- Integrated Constant Heat process control based on proven technology
- Ideal price-performance (throughput) ratio
- CE approved
- Pneumatic bond head, X-Y Hot Bar planarity adjustment and electronic system control included
| Power requirements | 100-240 VAC / Single Phase / 50/60 Hz (16 Amps max) |
|---|---|
| Air supply | 6 - 8 bar (87 - 116 psi), clean dry & filtered air |
| Fixture assembly baseplate dimensions | 150 x 150 mm |
| Fixture weight | 1.0 kg Max (per product fixture) |
| Constant heat thermode size (length x width) | Min 3 x 1 mm / Max 75 x 5 mm |
| Starting operation | Two hand control |
| Start-up time | < 5 minutes |
| Operating temperature | 15 - 40 °C |
| Operating humidity | Max 93% @ 40 °C |
| Certification | CE Approved |
| Bonding head & Temperature controller technical specifications | |
| Force range | 60 - 750 N @ 6 Bar |
| Bond head stroke (max) | 45 mm |
| Bond level height | 40 mm |
| Free Z space for components | 20 mm |
| Temperature range | 50 - 300 °C Constant heat |
| Temperature control accuracy | +/- 2% of Full Scale |
| Bond time period | 0,5 to 99,9 seconds |
| MODEL SPECIFICATIONS | |
| MHSB-3100 base | No movement |
| NH-3200 linear slide (manual 2-position front-rear slide) | Stroke between front and bonding position: 200 mm fixed |
| NH-3300 rotary table (manual 2-position) | Turntable diameter: 380 mm |
| NH-3400 automatic rotary table (pneumatic 2-position) | Turntable diameter: 380 mm. Turntable movement time: |
| Dimensions HxWxD (mm) | 650 x 615 x 695 |
| Weight | 60 kg |
CCD Camera
Multiple Flex
Flex - PCB
LCD Display
Customized Solutions
Send your sample to one of our technology centers in Europe for an evaluation. We will then determine which solution meets your needs best. AMADA WELD TECH offers feasibility testing and application consulting.