Hot Bar reflow soldering
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Heat-Seal/ACF Final Bonding Desktop Systems
The Desktop Series deliver the same high bonding quality as the larger and more automated systems. For production environments where labour costs are conservative, it offers an ideal price-performance (throughput) ratio. The flexibility of the system also makes it perfectly suited to R&D environments and integration into larger systems.
Key Features Heat-Seal/ACF Final Bonding Desktop Systems
- Small and flexible systems for high quality connections
- Ideal price-performance (throughput) ratio
- Simple adjustable fram construction
- For Heat-Seal bonding, Hot Bar Reflow Soldering and Heat Staking
- Reliable process control, by proven technology of Uniflow Power Supply
| Model | |||
|---|---|---|---|
| Power requirements | 100 to 240 Vac, 50/60 HZ, 16 Amp max | ||
| Air supply | 4-8 bar (60-120 psi), dry & filtered air | ||
| Maximum fixture height | 50 mm (1.97 inch) | ||
| Gantry open width | 520 mm (20.47 inch) | ||
| Fixture assembly baseplate | 160x160 mm (6.30 x 6.30 Inch) | ||
| Starting operation | Two hand control | ||
| Operating temperature | 15-40°C | ||
| Operating humidity | 93% @ 40 °C | ||
| Bonding head & uniflow technical specifications | |||
| Force range | SH 500:50.0 mm - SH 80: 8-80 N @ 6 bar | ||
| Hot Bar stroke | SH 500: 50.0 mm - SH 80 : 50.0 mm | ||
| Temperature range Idle | 25 to 100 °C | Heat | 60 to 600 °C |
| Temperature range Baseheat | 25 to 300 °C | Heat Extended Range | 60 to 999 °C |
| Temperature range Preheat | 60 to 300 °C | Postheat | 25 to 600 °C |
| Time period (in 0,1 sec increments) Base Heat | 0 to 99.9 seconds | Rise to Heat Time | 0 to 9.9 seconds |
| Time period (in 0,1 sec increments) Rise to preheat time | 0 to 9.9 seconds | Heat | 0.1 to 99.9 seconds |
| Time period (in 0,1 sec increments) Preheat | 0 to 99.9 seconds or continuous | Postheat | 0 to 99.9 seconds |
| Communications ports | RS-232, RS-485 | ||
| WEIGHT & DIMENSIONS | |||
| Dimensions HxWxD (mm) | 510 x 550 x 600 | ||
| Weight (in kg) | 40 kg (excluding Uniflow Power Supply) |
Heat-seal bonding
ACF bonding
Heat staking
Customized Solutions
Send your sample to one of our technology centers in Europe for an evaluation. We will then determine which solution meets your needs best. AMADA WELD TECH offers feasibility testing and application consulting.